Shielding base member and method of manufacturing the same

ABSTRACT

A radiation shielding structure includes a first adhesive layer, a resin layer, and a metal foil laminated sequentially on a release layer of a plastic film. A metal layer pattern is formed from the metal foil. The first adhesive layer, the resin layer, and the metal layer pattern are formed sequentially from the bottom on a transparent substrate by separating the release layer from the first adhesive layer along an interface and then adhering the first adhesive layer to the transparent substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims, under 35 USC 119, priority of JapaneseApplication No. 2001-155747 filed May 24, 2001 and Japanese ApplicationNo. 2002-54810 filed Feb. 28, 2002.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a shielding base member and a method ofmanufacturing the same and, more particularly, a shielding base memberfor shielding from electromagnetic radiation, etc., that leak out fromthe PDP (Plasma Display Panel), etc. and a method of manufacturing thesame.

2. Description of the Related Art

In recent years, the applications of the PDP (Plasma Display Panel),which has a wide viewing angle and good display quality and provides alarge screen, have broadened quickly into multimedia display devices,etc.

The PDP is a display device that utilizes a gaseous discharge. The gasthat is sealed in the tube is excited by using the discharge to generatea line spectrum that has a wide wavelength range extending from theultraviolet range to the near-infrared range. A fluorescent substance isarranged in the tube of the PDP. This fluorescent substance is excitedby the line spectrum in the ultraviolet range to generate light in thevisible range. A part of the line spectrum in the near-infrared range isemitted from the surface glass of the PDP to the outside of the tube.

The wavelength in this near-infrared range is close to the wavelength(800 nm to 1000 nm) that is employed in a remote control unit, opticalcommunication, etc. If these devices are operated near the PDP, it ispossible that a malfunction maybe caused and therefore leakage of thenear-infrared ray from the PDP must be prevented.

Also, the electromagnetic radiation such as microwave, ultra lowfrequency radiation, etc., are generated by the operation of the PDP,and then leak out to the outside, although amount of the leakage is verysmall. Since the provisions for leakage of electromagnetic radiation,etc., are specified in the information device or equipment, or the like,the leakage of the electromagnetic waves must be suppressed below thespecified value.

In addition, when rays of light are incident upon the display screenfrom the outside, the incident light is reflected by the display screenand also the contrast ratio of the screen is lowered since the displayscreen of the PDP is flat. Therefore, the reflection of the incidentlight from the outside must be suppressed.

For the purpose of satisfying these requirements, a shielding basemember is arranged in front of the display screen of the PDP.

In the related art, such a shielding base member is manufactured by themethod in which a plastic film to which a metal foil is adhered ispasted on the transparent glass substrate and then the metal foil ispatterned, or the like. More particularly, normally the thickness of themetal foil is thin, such as about 10 μm. Therefore, in order to make thehandling of the metal foil easy, first the metal foil is pasted onto theplastic film. Then, in order to pattern the metal foil with goodprecision, the plastic film having the metal foil thereon is pasted onthe glass substrate that has strong rigidity, and then the metal foil ispatterned.

In the related art, because the metal foil and the plastic film areformed integrally to make the handling of the metal foil easy, if theshielding base member is manufactured using same, the plastic filmremains on the shielding base member. The plastic film has low opticaltransmittance and high haze (degree of opaqueness), as compared with thetransparent glass substrate.

Accordingly, since the plastic film remains on the shielding basemember, the optical transmittance of the shielding base member islowered and the haze (degree of opaqueness) the shielding base member isincreased. As a result, there is the problem of poorer visibility of thescreen of the PDP due to the shielding base member.

In order to further increase the rigidity of the plastic film on whichthe metal foil is pasted, there is the shielding base member in whichthe metal foil is pasted onto the plastic film via an adhesive layer. Inthe case that the plastic film is rolled up on a roller in manufactureutilizing the roll-to-roll method, etc., if the adhesive layer ispressed by foreign matter, etc., dents are readily formed occurs in theadhesive layer because the adhesive layer is soft in itself and thequality of the shielding base member is lowered.

In other related art, the shielding base member includes a plastic filmhaving a near-infrared absorbing function. Thus, the structure of suchshielding base member becomes complicated and also incorporates theplastic film. As a result, there remain the problems that the opticaltransmittance of the shielding base member is further lowered and thatthe haze (degree of opaque) is further increased.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a shielding basemember with high optical transmittance and low haze (degree ofopaqueness), and a method of manufacturing the same.

Also, it is another object of the present invention to provide a methodof manufacturing a shielding base member having an adhesive layerwithout denting.

The present invention provides a shielding base member manufacturingmethod which comprises the steps of forming a structure, in which afirst adhesive layer, a resin layer, and a metal foil are laminatedsequentially on a release layer of a plastic film that has the releaselayer at one surface, forming a metal layer pattern by patterning themetal foil, and forming the first adhesive layer, the resin layer, andthe metal layer pattern, in this order, on a transparent substrate byseparating the release layer from the first adhesive layer along aninterface and then pasting the first adhesive layer onto the transparentsubstrate.

As described above, since the handling of the metal foil that ispatterned is not easy, the metal foil is pasted onto the plastic filmvia the resin layer and then the plastic film having the metal foilthereon is pasted onto a transparent substrate such as a glass substratehaving strong rigidity. As a result, the plastic film whose opticaltransmittance is low and whose haze (degree of opaqueness) is highremains in the shielding base member.

The shielding base member manufacturing method of the present inventiondoes not leave the plastic film in the shielding base member.

More particularly, first the adhesive layer, the resin layer, and themetal foil are formed on the surface of a plastic film on which arelease layer is formed. Then, the metal layer pattern is formed bypatterning the metal foil.

Since the metal foil is supported on the plastic film via the adhesivelayer and the resin layer, the plastic film has rigidity and thus thehandling of the metal foil can be facilitated. Accordingly, there is noneed to form a pattern in the metal foil after this plastic film ispasted onto the transparent substrate. As a result, the roll-likeplastic film onto which the metal foil is pasted is extended and thenthe metal foil can be patterned by the so-called roll-to-roll method.

After the release layer formed on the plastic film is separated from thefirst adhesive layer along the interface, the first adhesive layer, theresin layer, and the patterned metal layer are pasted onto a transparentsubstrate such as a glass substrate.

Thus, the shielding base member is free of a plastic film whose opticaltransmittance is low and whose haze is high.

As described above, according to the shielding base member manufacturingmethod of the present invention, the patterning of the metal foil can becarried out by the roll-to-roll method and thus the productionefficiency of the shielding base member can be improved. Also, since theplastic film is not left in the shielding base member, a shielding basemember whose optical transmittance is high and whose haze is low can beeasily manufactured.

Also, the present invention provides a shielding base membermanufacturing method which comprises the steps of forming a structure inwhich a first adhesive layer, a resin layer, and a metal foil arelaminated in sequence, on a release layer of a plastic film, separatingthe release layer from the first adhesive layer along an interface andthen pasting the first adhesive layer onto the transparent substrate,and forming a metal layer pattern by patterning the metal foil.

According to the present invention, first the first adhesive layer, theresin layer, and the metal layer are formed on the plastic film via therelease layer, then the release layer is separated from the firstadhesive layer along the interface, and then the first adhesive layer,the resin layer, and the metal layer are pasted onto the transparentsubstrate. Then, a metal layer pattern is formed in the metal layer onthe transparent substrate.

According to the above embodiment of the shielding base membermanufacturing method, the metal layer pattern is formed by patterningthe metal foil, which is formed over the plastic film, by theroll-to-roll method. In contrast, according to another embodiment of thepresent invention, the first adhesive layer, the resin layer, and themetal layer are transferred onto the transparent substrate, and then themetal layer is patterned. Also, if a substrate having a strong rigiditysuch as a glass substrate, for example, is employed as the transparentsubstrate, stable metal layer patterns can be formed.

Also, the present invention provides a shielding base membermanufacturing method which comprises the steps of preparing a firstplastic film including a first adhesive layer, a resin layer, and ametal foil in sequence on a surface, forming a metal layer pattern bypatterning the metal foil, forming the resin layer and metal layerpattern on a second adhesive layer of a second plastic film, which has arelease layer and the second adhesive layer sequentially formed on asurface, by separating the first adhesive layer from the resin layeralong an interface, then pasting a surface of the second adhesive layerof the second plastic film onto a surface of the resin layer, separatingthe release layer from the second adhesive layer along an interface andthen pasting a surface of the second adhesive layer onto the transparentsubstrate.

In the present invention, first the first plastic film that has thesequence of the first adhesive layer, the resin layer, and the metalfoil formed on its surface is prepared, and then the metal layerpatterns are formed by patterning the metal foil. If the roll-to-rollmethod is employed for the purpose of improving the productionefficiency, dents are easily generated in the first adhesive layer byforeign matter, or the like when the first plastic film is wound on theroll. Then, the first transfer body consisting of the resin layer andthe metal layer patterns formed thereon is obtained by separating thefirst adhesive layer of the first plastic film from the resin layeralong the interface.

Then, the second plastic film having the release layer and the secondadhesive layer formed in sequence from the bottom is prepared. Then, theexposed surface of the second adhesive layer is pasted onto the surfaceof the resin layer, on which metal layer pattern is formed, in the firsttransfer body. Accordingly, the resin layer and the metal layer patternare formed on the second adhesive layer of the second plastic film. Thatis, the new second adhesive layer in which the dent defect is notgenerated is formed under the resin layer in place of the first adhesivelayer in which the dent defect is generated.

Then, the second adhesive layer is separated from the resin layer alongthe interface to form a second transfer sheet consisting of the secondadhesive layer, the resin layer, and the metal layer patternsequentially from the bottom. Then, the exposed surface of the secondadhesive layer of this second transfer sheet is pasted onto one surfaceof the glass substrate to form a shielding base member that has nodents.

As described above, according to the present invention, since theplastic film does not remain in the shielding base member, a shieldingbase member having high optical transmittance and low haze can be easilymanufactured. Also, since the metal foil is formed on the first plasticfilm having the first adhesive layer and high rigidity, the metal foilcan be patterned by the roll-to-roll method while expanding the plasticfilm, and thus the production efficiency can be improved.

In addition, even if dents form in the first adhesive layer at thistime, the first adhesive layer can be replaced by the new secondadhesive layer in later steps. Since the roll-to-roll method is notneeded in the step after the second adhesive layer is formed, theshielding base member can be manufactured without winding the secondadhesive layer on the roll. Therefore, no dent is formed in the secondadhesive layer of the shielding base member, and thus a shielding basemember of high quality can be manufactured with high yield.

Also, the present invention provides a shielding base membermanufacturing method which comprises the steps of preparing a firstplastic film including a first adhesive layer, a resin layer, and ametal foil sequentially on a surface, forming a metal layer pattern bypatterning the metal foil, forming a resin layer and the metal layerpattern on a second adhesive layer of a second plastic film, which has arelease layer, separating the first adhesive layer from the resin layeralong an interface and then pasting a surface of the second adhesivelayer of the second plastic film onto a surface of the resin layer, andseparating the release layer from the second adhesive layer along aninterface. In this embodiment, unlike the previously described methodembodiments, the shielding base member is not formed by pasting thesecond transfer body (the second adhesive layer, the resin layer, andthe metal layer patterns) onto a transparent substrate, but the memberconsisting of the second adhesive layer, the resin layer, and the metallayer pattern is used as the shielding base member by exposing thesurface of the second adhesive layer and pasting that exposed surfacedirectly onto the display screen of the PDP.

The present invention also provides a shielding base member whichcomprises a transparent substrate, a first adhesive layer formed on thetransparent substrate; a resin layer formed on the first adhesive layer,a metal layer pattern formed on the resin layer, and a reflectionpreventing layer formed on the metal layer pattern and the resin layervia a third adhesive layer.

The shielding base member of the present invention is the shielding basemember manufactured by any of the above-described manufacturing methods.Since this shielding base member does not contain the plastic film whoseoptical transmittance is low and whose haze is high, the visibility ofthe PDP can be improved when such a shielding base member is employed asthe shielding base member of the PDP.

Also, the present invention provides a shielding base member whichcomprises a transparent substrate, a first adhesive layer formed on thetransparent substrate, a resin layer formed on the first adhesive layerand having at least a near-infrared absorbing function, a metal layerpattern formed on the resin layer, and a filter layer formed on themetal layer pattern and the resin layer via a second adhesive layer andhaving at least a reflection preventing function.

According to the present invention, the plastic film employed as thesubstrate that facilitates the handling of the metal foil does notremain in the shielding base member. The near-infrared absorbingfunction is provided by incorporating a pigment material, that absorbs apredetermined wavelength of the near-infrared portion of the spectrum,into the resin layer. Therefore, unlike the related art, there is noneed to separately form the plastic film having the near-infraredabsorbing function.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A to FIG. 1D are schematic sectional views showing a first methodfor manufacturing a shielding base member according to a firstembodiment of the present invention;

FIG. 2A to FIG. 2D are schematic sectional views showing a second methodfor manufacturing a shielding base member according to the firstembodiment of the present invention;

FIG. 3A is a schematic sectional view showing the shielding base memberaccording to the first embodiment of the present invention, and FIG. 3Bis a schematic sectional view showing a variation of the shielding basemember according to the first embodiment of the present invention;

FIG. 4 is a schematic sectional view showing a shielding base memberaccording to a second embodiment of the present invention;

FIG. 5 is a schematic sectional view showing a shielding base memberaccording to a third embodiment of the present invention;

FIG. 6 is a schematic sectional view showing a shielding base memberaccording to a fourth embodiment of the present invention;

FIG. 7 is a schematic sectional view showing a shielding base memberaccording to a fifth embodiment of the present invention;

FIG. 8A is a schematic sectional view showing a shielding base memberaccording to a sixth embodiment of the present invention, and FIG. 8B isa schematic sectional view showing a variation of the shielding basemember according to the sixth embodiment of the present invention;

FIG. 9A to FIG. 9G are schematic sectional views showing a shieldingbase member manufacturing method according to a seventh embodiment ofthe present invention;

FIG. 10A to FIG. 10C are schematic sectional views showing a shieldingbase member manufacturing method according to an eighth embodiment ofthe present invention;

FIG. 11 is a schematic sectional view showing a shielding base memberaccording to the eighth embodiment of the present invention;

FIG. 12 is a schematic sectional view showing a shielding base memberaccording to a ninth embodiment of the present invention; and

FIG. 13 is a schematic sectional view showing a variation of theshielding base member according to the ninth embodiment of the presentinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention will be explained with reference tothe drawings hereinafter.

First Embodiment

Manufacturing methods for producing the shielding base member accordingto the first embodiment of the present invention will first bedescribed.

First Manufacturing Method

As shown in FIG. 1A, a PET (polyethylene terephthalate) film 30 a isused as an example of the plastic film. A silicone layer 30 b (releaselayer) of 1 μm, for example, is coated on one surface of this PET film30 a.

To form the silicone layer 30 b a solution of 600 wt % in total isformed by mixing 100 parts by weight of the silicone (KS-3703manufactured by Shin-Etsu Chemical Co., Ltd.), 1 part by weight of thecatalyst (CAT-PL-50T), and 499 parts by weight of solvent (toluene).Then, the silicone layer 30 b is formed by coating this solution on thePET film 30 a by a bar coater, and then annealing at 120° C. for 30seconds: This plastic film 30 a on one surface of which the siliconelayer 30 b is formed is referred to as “separator 30” hereinafter.

Then, a first adhesive layer 12 having a thickness of 10 to 50 μm,preferably 25 μm, for example, is formed on the surface of the separator30, on which the silicone layer 30 b is formed.

Then, a copper foil 16 (metal foil) of 10 μm thickness, for example, isprepared. The bright surface of this copper foil 16 is blackened byimmersing the copper foil 16 in a mixed solution consisting of a copperpyrophosphate aqueous solution, a potassium pyrophosphate aqueoussolution, and an ammonia aqueous solution, for example, withelectrolytic plating at a current density of 5 A/cm² for 10 seconds.

Then, a resin layer 14 is formed on the first adhesive layer 12. Thecopper foil 16 is placed on the resin layer 14 with its blackenedsurface opposite the resin layer 14 side, and then is adhered to theresin layer 14 by baking at 80° C. for 20 seconds and pressing under 5kg/cm², for example.

The resulting structure has the first adhesive layer 12, the resin layer14, and the copper foil 16 laminated on the separator 30 in sequence.Since not only the resin layer 14 but also the first adhesive layer 12is formed between the separator 30 and the copper foil 16, the rigidityof the separator 30 can be enhanced.

Then, as shown in FIG. 1B, a resist film (not shown) is formed on thecopper foil 16 by the roll-to-roll method and then the copper foil 16 isetched by spraying with an iron (III) chloride aqueous solution, forexample, using the resist film as a mask. Thus, copper layer pattern 16a is formed as a mesh, for example.

The presence of the first adhesive layer 12 between the separator 30 andthe copper foil 16 enhances the rigidity and, accordingly, the separator30 can withstand the pressure of the sprayed etchant and the copper foil16 can be stably etched. Also, in the case of the structure in which thefirst adhesive layer 12 is exposed after the copper foil 16 is etched,i.e., in the case of the structure from which the resin layer 14 isomitted, the first adhesive layer 12 is changed from transparent to ayellow color by the etchant. However, in the present embodiment, sincethe cured resin layer 14 is present on the first adhesive layer 12, thetransparency of the first adhesive layer 12 can be maintained.

Then, the exposed surface of the copper layer pattern 16 a is blackenedby using a mixed solution consisting of a chlorite soda aqueous solutionand a caustic soda aqueous solution. Since the surface of the copperfoil 16 on the resin layer 14 side is blackened in the above step, allsurfaces and side surfaces of the copper layer pattern 16 a areblackened when this step is finished.

In this manner, as shown in FIG. 1B, a transfer sheet 32 consisting ofthe first adhesive layer 12, the resin layer 14, and the copper layerpattern 16 a is formed on the separator 30.

Then, as shown in FIG. 1C, the separator 30 and the first adhesive layer12 are separated along their interface. At this time, since the adhesivestrength between the silicone layer 30 b and the first adhesive layer 12is weaker than that between the silicone layer 30 b and the PET film 30a, the transfer sheet 32 can be easily separated along the interfacebetween the separator 30 and the first adhesive layer 12.

Then, as shown in FIG. 1D, a transparent glass substrate 10 (transparentsubstrate), on a peripheral portion of one surface of which a blackframe layer 22 is formed, is prepared. The exposed surface of the firstadhesive layer 12 is then pasted onto the surface of the glass substrate10, with the black frame layer 22 omitted. Accordingly, the transfersheet 32 that consists of the first adhesive layer 12, the resin layer14, and the copper layer pattern 16 a, in this sequence, is formed onthe glass substrate 10.

Then, as shown in FIG. 3A, a second adhesive layer 12 a having a colorcorrecting function is formed on the copper layer pattern 16 a and theresin layer 14 such that the copper layer pattern 16 a on the peripheralportion is exposed. Then, a near-infrared absorbing layer 18 is formedon this second adhesive layer 12 a.

A third adhesive layer 12 b having an ultraviolet (UV) absorbingfunction is then formed on the near-infrared absorbing layer 18. A PETreflection preventing layer 20 is formed on the third adhesive layer 12b by using a PET film with a reflection preventing layer formed on onesurface thereof.

Second Manufacturing Method

The second manufacturing method differs from the first manufacturingmethod in that metal patterns are formed by patterning after the metallayer is transferred onto the glass substrate. Therefore, in FIG. 2A toFIG. 2D, the same symbols are affixed to the same elements as those inFIG. 1A to FIG. 1D, and their detailed explanation will be omittedherein.

First, as shown in FIG. 2A, in the same manner as the firstmanufacturing method, a structure in which the first adhesive layer 12,the resin layer 14, and the copper foil 16, the surface of which on theresin layer 14 side is subjected to the blackening process, are formedon the separator 30.

Then, as shown in FIGS. 2B and 2C, in the same manner as in the firstmanufacturing method, the silicone layer 30 b and the first adhesivelayer 12 are separated along their interface, and then the firstadhesive layer 12 is pasted onto the surface of the glass substrate 10,without the black frame layer. Thus, a transfer sheet 32 a that consistsof the first adhesive layer 12, the resin layer 14, and the copper foil16, in this sequence, is formed on the glass substrate 10.

Then, as shown in FIG. 2D, the copper layer patterns 16 a are formed bypatterning the resist film (not shown) on the copper foil 16 and etchingthe copper foil 16 with an iron (III) chloride aqueous solution, forexample, while using the resist film as a mask.

In the second manufacturing method, the first adhesive layer 12, theresin layer 14, and the copper foil 16 are transferred onto the glasssubstrate 10, and then the copper layer pattern 16 a is formed bypatterning the copper foil 16. Since the copper foil is patterned whileon the highly rigid glass substrate, the precision of the patterning ofthe resist film is increased and therefore the finer copper layerpatterns can be stably formed.

Then, blackening of the side surfaces of the copper pattern 16 a iseffected by the same method used in the first manufacturing method.

Accordingly, as shown in FIG. 2D, a structure similar to that in FIG. 1Dis formed, i.e., the first adhesive layer 12, the resin layer 14, andthe copper layer pattern 16 a is formed sequentially from the glasssubstrate.

Then, as shown in FIG. 3A, the near-infrared absorbing layer 18 isformed on the copper layer pattern 16 a and the resin layer 14 via asecond adhesive layer 12 a having a color correcting function by thesame method as the first manufacturing method. Then, a PET reflectionpreventing layer 20 is formed on the near-infrared absorbing layer 18via a the third adhesive layer 12 b having an ultraviolet (UV) absorbingfunction, to complete the shielding base member 26.

In the shielding base member 26 of the present embodiment, as shown inFIG. 3A, the mesh-like copper layer pattern 16 a, for example, is formedon one surface of the glass substrate 10 via the first adhesive layer 12and the resin layer 14. All surfaces of the copper pattern 16 a areblackened to eliminate the metal luster and to exhibit a blackish color.

Then, the near-infrared absorbing layer 18 is formed on the copperpattern 16 a and the resin layer 14 via the second adhesive layer 12 a,and then the PET reflection preventing layer 20 is formed on thenear-infrared absorbing layer 18 via the third adhesive layer 12 b. Theultraviolet (UV) absorber is incorporated into the third adhesive layer12 b formed directly under the PET reflection preventing layer 20, andthus the third adhesive layer 12 b has the ultraviolet (UV) absorbingfunction. Also, for example, the second adhesive layer 12 a has thecolor correcting function. In this case, at least one of the first,second, and third adhesive layers 12, 12 a, 12 b may have the colorcorrecting function.

The second adhesive layer 12 a, the near-infrared absorbing layer 18,the third adhesive layer 12 b, and the PET reflection preventing layer20 are formed to leave exposed a peripheral portion of the copperpattern 16 a. The copper pattern 16 a exposed at the peripheral portionof the glass substrate 10 is connected to the ground circuit of the PDPto prevent it from carrying a charge.

The black frame layer 22 is formed on the peripheral portion of theother surface of the glass substrate 10. In this case, the black framelayer 22 may be formed on the peripheral portion of one surface of theglass substrate 10, i.e., on the peripheral portion of the glasssubstrate 10 on the first adhesive layer 12 side. Optionally, the blackframe layer 22 may be omitted.

The shielding base member 26 is arranged on the PDP such that the copperlayer pattern 16 a formed on the peripheral portion of the glasssubstrate 10 is connected electrically to the ground terminal of thecasing of the PDP, the surface of the glass substrate 10 on the blackframe layer 22 side is directed to the display screen side of the PDP,and the surface of the glass substrate 10 on the first adhesive layer 12side is directed to the viewer side of the PDP. Since the copper layerpattern 16 a is a good conductor, the electromagnetic radiation such asmicrowave, ultra low frequency radiation, etc., emitted from the displayscreen of the PDP can be shielded.

The manufacturing methods for producing the shielding base member 26 ofthe present embodiment are designed so as not to leave the PET film 30a, whose optical transmittance is low and whose haze (degree ofopaqueness) is high, in the shielding base member 26. Thus, theseparator 30, in which the silicone layer 30 b is formed as a releaselayer on the PET film 30 a, is employed so that the PET film 30 a can beeasily separated from the transfer sheet 32 or 32 a that consists of thefirst adhesive layer 12, the resin layer 14, and the copper layerpattern 16 a or the copper foil 16 formed on the PET film 30 a.

More particularly, in the first manufacturing method, rigidity isincreased by pasting the copper foil 16, which is not easily handled,onto the separator 30 via the first adhesive layer 12 and the resinlayer 14, and then the copper layer pattern 16 a is formed by etchingthe copper foil with the roll-like separator 30 unrolled.

Then, since the silicone layer 30 b is formed at the interface betweenthe separator 30 and the first adhesive layer 12, the separator 30 canbe easily separated from the first adhesive layer 12 along thisinterface. Therefore, the transfer sheet 32 that consists of the firstadhesive layer 12, the resin layer 14, and the copper layer pattern 16 acan be adhered to the glass substrate 10.

In doing this, the copper foil 16 can be patterned while on theseparator 30 by the so-called roll-to-roll method and thus theproduction efficiency can be improved.

In the second manufacturing method, after the first adhesive layer 12,the resin layer 14, and the copper foil 16 are transferred onto theglass substrate 10, the copper layer pattern 16 a is formed in thecopper foil 16. Also, in this second manufacturing method, the shieldingbase member without the PET film 30 a can be easily manufactured.

In this manner, the shielding base member 26 of the present embodimentis free of PET film other than the PET reflection preventing layer 20.Therefore, the optical transmittance of the shielding base member can beincreased and also the haze can be reduced.

Also, the shielding base member 26 of the present embodiment has the PETreflection preventing layer 20 to suppress the reflection of light fromthe outside. Therefore, the electromagnetic radiation can be shieldedand also the contrast ratio of the display screen of the PDP can beimproved. In addition, since the reflection preventing layer 20 isformed of PET film, the adhesiveness between the PET reflectionpreventing layer 20 and the third adhesive layer 12 b is improved.

In addition, since the shielding base member 26 of the presentembodiment has a near-infrared absorbing function, there is nopossibility of malfunction if a remote control unit, or the like isoperated near the PDP.

Further, since the shielding base member 26 of the present embodimenthas the ultraviolet (UV) absorbing function, the ultraviolet rays thatare harmful to the human body can be blocked. Furthermore, since theshielding base member 26 of the present embodiment has a colorcorrecting function, the luminous intensity in the concerned color canbe corrected even if the light emission in some color in the PDP isenhanced. For example, because a mixed gas consisting of xenon and neonis employed in the color PDP as a discharge medium, the orange colorlight emission of the neon acts as one factor to lower the color displayperformance of the PDP. Therefore, in the shielding base member 26 ofthe present embodiment, color correction of the PDP color display can beachieved by incorporating a pigment of a color which can suppress thelight emission of the neon, for example, in the adhesive layer.

Next, a variation of the method of manufacturing the shielding basemember according to the present embodiment will be explained hereunder.

First, the structure shown in FIG. 1D is manufactured by the firstmethod, or the structure shown in FIG. 2D is manufactured by the secondmethod.

Then, as shown in FIG. 3B, a PET film 21 is prepared, and then areflection preventing layer 25 is formed on one surface of this PET film21 and also a near-infrared absorbing layer 23 is formed on the othersurface of this PET film 21. Thus, a plastic film 21 that has thereflection preventing function on one surface and has the near-infraredabsorbing function on the other surface is prepared.

Then, as shown in FIG. 3B, the second adhesive layer 12 a is formed onthe copper layer pattern 16 a and the resin layer 14. Then, the surfaceof the PET film 21 on the near-infrared absorbing layer 23 side isadhered to the glass substrate 10 via this second adhesive layer 12 a.Accordingly, as shown in FIG. 3B, the PET film 21, having thenear-infrared absorbing layer 23 formed on one surface and thereflection preventing layer 25 formed on the other surface, issubstituted for the combination of the near-infrared absorbing layer 18,the third adhesive layer 12 b, and the PET reflection preventing layer20, which are formed on the second adhesive layer 12 a in FIG. 3A.

According to the variation described above, a shielding base member 26 ghaving substantially the same functions as the previously describedshielding base member can be obtained and thus similar effects can beachieved. Also, since the PET film having the near-infrared absorbingfunction and the reflection preventing function is pasted onto the glasssubstrate having the copper layer pattern, the manufacture of theshielding base member 26 g is easier than that of the shielding basemember 26 and also the structure thereof can be simplified.

Second Embodiment

FIG. 4 is a schematic sectional view showing a shielding base memberaccording to a second embodiment of the present invention. The shieldingbase member of the second embodiment differs from the shielding basemember of the first embodiment in that it has no separate near-infraredabsorbing layer and such function is given to the adhesive layer.Therefore, in FIG. 4, the same symbols are affixed to the same elementsas those in FIG. 3A, and their detailed explanation will be omittedhere.

As shown in FIG. 4, the shielding base member 26 a of the secondembodiment has a structure lacking a separate near-infrared absorbinglayer. The copper layer pattern 16 a is formed on the glass substrate 10via the first adhesive layer 12 and the resin layer 14, and then the PETreflection preventing layer 20 is formed on the copper layer pattern 16a via the third adhesive layer 12 b having the near-infrared absorbingfunction. In this manner, since the third adhesive layer 12 b has thenear-infrared absorbing function, there is no need for a separatenear-infrared absorbing layer.

Also, at least one of the first adhesive layer 12 and the third adhesivelayer 12 b has the ultraviolet (UV) absorbing function. In addition, atleast one of the first adhesive layer 12 and the third adhesive layer 12b has the color correcting function.

In this case, the near-infrared absorbing function may be provided bythe first adhesive layer 12 instead of the third adhesive layer 12 b,otherwise both layers may have the near-infrared absorbing function.Also, the black frame layer 22 may be omitted.

The shielding base member 26 a of the present embodiment can bemanufactured by the same manufacturing method as the shielding basemember of the first embodiment.

The shielding base member 26 a of the present embodiment providessimilar effects to those of the shielding base member 26 of the firstembodiment. Also, since there is no need for a separate near-infraredabsorbing layer, the manufacture of the shielding base member of thepresent embodiment is easier. In addition, since the near-infraredabsorbing layer is omitted and the optical transmittance can be improvedaccordingly, the visibility of the PDP is improved over that having theshielding base member 26 of the first embodiment.

Third Embodiment

FIG. 5 is a schematic sectional view showing a shielding base memberaccording to a third embodiment of the present invention. The differencebetween the shielding base member of the third embodiment and theshielding base member of the first embodiment is that in the thirdembodiment the metal layer pattern of the shielding base member isformed on the surface of the transparent substrate on the PDP side andreflection preventing layers are formed on both surfaces of thetransparent substrate. Therefore, in FIG. 5, the same symbols areaffixed to the same elements as those in FIG. 3A, and their detailedexplanation is omitted here.

As shown in FIG. 5, in the shielding base member 26 b of the thirdembodiment, the black frame layer 22 is formed on one surface of theglass substrate 10, i.e., the surface on the PDP side, and the copperlayer pattern 16 a is formed on the black frame layer 22 and the glasssubstrate 10 via a first adhesive layer 12 c and the resin layer 14.

The near-infrared absorbing layer 18 is formed on the other surface ofthe glass substrate 10 via a second adhesive layer 12 d, and also afirst PET reflection preventing layer 20 a is formed on thisnear-infrared absorbing layer 18 via a third adhesive layer 12 e. Then,a second PET reflection preventing layer 20 b is formed on the copperlayer pattern 16 a via a fourth adhesive layer 12 f.

In this case, the near-infrared absorbing layer 18 may be formed betweena fourth adhesive layer 12 f and the second PET reflection preventinglayer 20 b, and the second PET reflection preventing layer 20 b may beformed on the near-infrared absorbing layer 18 via the second adhesivelayer 12 d. Also, instead of provision of the near-infrared absorbinglayer 18 and the second adhesive layer 12 d, the near-infrared absorbinglayer may be coated on the surface of the second PET reflectionpreventing layer 20 b on the PDP side.

In the shielding base member 26 b of the third embodiment, the first PETreflection preventing layer 20 a is formed on the surface of the glasssubstrate 10 on the PDP operator side, and the second PET reflectionpreventing layer 20 b is formed on the surface of the glass substrate 10on the PDP side. Neither the first PET reflection preventing layer 20 anor the second PET reflection preventing layer 20 b has an ultraviolet(UV) absorbing function. Alternatively, at least one of the first,second, third, and fourth adhesive layers 12 c, 12 d, 12 e, 12 f mayhave an ultraviolet (UV) absorbing function. It is preferable that thethird adhesive layer 12 e should have the ultraviolet (UV) absorbingfunction.

Also, at least one of the first, second, third, and fourth adhesivelayers 12 c, 12 d, 12 e, 12 f has a color correcting function. It ispreferable that the second adhesive layer 12 d should have the colorcorrecting function. Optionally, the black frame layer 22 may beomitted.

The shielding base member 26 b of the third embodiment provides effectssimilar to those of the shielding base member of the first embodiment.Also, since the first PET reflection preventing layer 20 a and thesecond PET reflection preventing layer 20 b are formed on the surfacesof the shielding base member on the PDP operator side and the PDP side,respectively, the reflection of the light irradiated from the outsideand the reflection of the light emitted from the display screen of thePDP are suppressed and thus the contrast ratio of the display screen ofthe PDP is improved.

Also, the shielding base member 26 b of the third embodiment has thecopper layer pattern 16 a formed on the surface of the glass substrate10, on which the black frame layer 22 is formed, via the first adhesivelayer 12 c and the resin layer 14. Here, assuming the case where the PETfilm 30 a still remains between the first adhesive layer 12 c and theresin layer 14, since the PET film 30 a has rigidity to some extent, thefirst adhesive layer 12 c is pulled toward the PET film 30 a side so asnot to enter into stepped portions (areas “A” in FIG. 5) at patternedges of the black frame layer 22, and thus bubbles are readily formedin these stepped portions. Accordingly, lines due to the bubbles aregenerated along the pattern edges of the black frame layer 22, and thusthe appearance of the PDP is damaged and its visibility is reduced.

However, according to the present embodiment, since the PET film 30 a isnot present, the first adhesive layer 12 c fills in the stepped portions(areas “A” in FIG. 5) at the pattern edges of the black frame layer 22and buries the stepped portions. As a result, the lines due to bubblesare not seen along the pattern edges of the black frame layer 22, andthus the appearance of the PDP and its visibility are maintained.

Next, the method of manufacturing the shielding base member 26 b of thethird embodiment will be explained.

First, in the same way as in the first manufacturing method of the firstembodiment, the transfer sheet 32 consisting of the first adhesive layer12 c, the resin layer 14, and the copper layer pattern 16 a, which areformed on the separator 30, is separated from the separator 30 and thenadhered to one surface of the glass substrate 10, on which the blackframe layer 22 is formed. Because no PET film is included in thetransfer sheet 32, the transfer sheet 32 can be adhered to the glasssubstrate 10 such that the first adhesive layer 12 c follows the steppedportions A of the black frame layer 22 and fills in the stepped portionsA.

Otherwise, in the same way as the second manufacturing method of thefirst embodiment, the transfer sheet 32 a, consisting of the firstadhesive layer 12 c, the resin layer 14, and the copper foil 16, whichare formed on the separator 30, is separated from the separator 30 andthen pasted onto one surface of the glass substrate 10, on which theblack frame layer 22 is formed.

Then, if the second manufacturing method is employed, the copper layerpattern 16 a is formed by patterning the copper foil 16 over the glasssubstrate 10. The second PET reflection preventing layer 20 b is formedon the copper layer pattern 16 a and the resin layer 14 via the fourthadhesive layer 12 f. Then, the near-infrared absorbing layer 18 isformed on the other surface of the glass substrate 10 via the secondadhesive layer 12 d, and then the first PET reflection preventing layer20 a is formed on the near-infrared absorbing layer 18 via the thirdadhesive layer 12 e, to complete the shielding base member 26 b of thethird embodiment.

Fourth Embodiment

FIG. 6 is a schematic sectional view showing a shielding base memberaccording to a fourth embodiment of the present invention. The shieldingbase member of the fourth embodiment is formed by using a differentmaterial for the reflection preventing layer in the shielding basemember of the first embodiment. Therefore, in FIG. 6, the same symbolsare affixed to the same elements as those in FIG. 3A, and their detailedexplanation is omitted here.

The difference between the shielding base member 26 c of the fourthembodiment and the shielding base member 26 of the first embodiment isthat, as shown in FIG. 6, a TAC (triacetylcellulose) film is employed inplace of the PET film as a reflection preventing layer 20 c. Since thisTAC reflection preventing layer 20 c also has an ultraviolet (UV)absorbing function, there is no need for the third adhesive layer 12 b,for example, to have an ultraviolet (UV) absorbing function.

Also, like the shielding base member 26 of the first embodiment, atleast one of the first, second, and third adhesive layers 12, 12 a, 12 bhas a color correcting function. In this case, the black frame layer 22may be omitted. Also, like the variation of the shielding base member ofthe first embodiment, the TAC film may have a reflection preventinglayer on one surface and a near-infrared absorbing layer on its othersurface to allow omission of the near-infrared absorbing layer 18, thethird adhesive layer 12 b, and the TAC reflection preventing layer 20 c.The surface of the near-infrared absorbing layer of this TAC film may beadhered to the second adhesive layer 12 a over the glass substrate 10.

With the shielding base member 26 c of this fourth embodiment, since theTAC reflection preventing layer 20 c is employed as the reflectionpreventing layer, the optical transmittance of the shielding base membercan be improved over that of the first embodiment in which the PETreflection preventing layer is employed. As a result, the visibility ofthe PDP can be improved over that of the shielding base member 26 b ofthe first embodiment.

Fifth Embodiment

FIG. 7 is a schematic sectional view showing a shielding base memberaccording to a fifth embodiment of the present invention. The shieldingbase member of the fifth embodiment is formed by using a differentmaterial for the reflection preventing layer in the shielding basemember of the third embodiment. Therefore, in FIG. 7, the same symbolsare affixed to the same elements as those in FIG. 5, and their detailedexplanation is omitted here.

The difference between the shielding base member 26 d of the presentembodiment and the shielding base member 26 b of the third embodiment isthat, as shown in FIG. 7, a TAC film is employed instead of a PET filmas the reflection preventing layer. In other words, a first TACreflection preventing layer 20 d, i.e., a TAC film having a reflectionpreventing layer, is formed on the surface of the glass substrate 10 onthe PDP operator side, and a second TAC reflection preventing layer 20 eis similarly formed on the surface of the glass substrate 10 on the PDPside.

Also, at least one of the first TAC reflection preventing layer 20 d andthe second TAC reflection preventing layer 20 c has an ultraviolet (UV)absorbing function. None of the first, second, third and fourth adhesivelayers 12 c, 12 d, 12 e, 12 f has an ultraviolet (UV) absorbingfunction.

Also, at least one of the first, second, third and fourth adhesivelayers 12 c, 12 d, 12 e, 12 f has a color correcting function. It ispreferable that the second adhesive layer 12 d has the color correctingfunction. In this case, the black frame layer 22 may be omitted.

According to the shielding base member 26 d of the present embodiment,the first and second TAC reflection preventing layers 20 d, 20 e canimprove the optical transmittance in contrast to the PET reflectionpreventing layer. Therefore, the visibility of the PDP can be improvedover that of the shielding base member 26 b of the third embodiment.

Sixth Embodiment

FIG. 8A and FIG. 8B are schematic sectional views showing a shieldingbase member according to a sixth embodiment of the present invention.Unlike the shielding base members of the first and second embodiments,the shielding base member of the sixth embodiment employs, as thetransparent substrate, instead of the glass substrate, the separatorhaving a release layer on its surface. Therefore, in FIG. 8A and FIG.8B, the same symbols are affixed to the same elements as those in FIG.3A, and their detailed explanation is omitted.

As shown in FIG. 8A, the transparent substrate of the shielding basemember 26 e of the sixth embodiment is formed of a separator 40. Thisseparator 40 consists of a silicone layer 40 b and a PET film 40 a.

When this shielding base member 26 e is fitted to the display screen ofthe PDP, the silicone layer 40 b is separated along the interfacebetween the silicone layer 40 b and the first adhesive layer 12 and thenan exposed surface of the first adhesive layer 12 of the resultingstructural unit B of the shielding base member, without the separator40, is pasted directly onto the display screen of the PDP, whereby thestructural unit B functions as the shielding member of the PDP.

When this shielding base member 26 e of the sixth embodiment is fittedto the display screen of the PDP, the PET film 40 a is not present.Therefore, the shielding base member has high optical transmittance andlow haze.

Also, since the glass substrate is not needed, the structure of theshielding base member can be made simple. Thus, not only can theshielding base member of the sixth embodiment be manufactured easily,but also the production cost thereof can be reduced.

The reflection preventing layer 20 may be formed of either a PETreflection preventing layer or a TAC reflection preventing layer. If thePET reflection preventing layer is employed, the third adhesive layer 12b, for example, may have the ultraviolet (UV) absorbing function, likethe first embodiment. If the TAC reflection preventing layer isemployed, the TAC reflection preventing layer 20 itself may have theultraviolet (UV) absorbing function, like the fourth embodiment. Also,like the first embodiment, at least one adhesive layer may have a colorcorrecting function.

A shielding base member shown in FIG. 8B is a variation of the shieldingbase member 26 e shown in FIG. 8A. The second adhesive layer 12 a andthe near-infrared absorbing layer 18 of the shielding base member 26 eshown in FIG. 8A are omitted. In this variation, like the secondembodiment, at least one of the first adhesive layer 12 and the thirdadhesive layer 12 b may have a near-infrared absorbing function.

Next, the manufacturing method of the shielding base member 26 e of thesixth embodiment will be explained hereunder.

First, according to a method similar to the first embodiment, the rolllike separator 40 is a PET film 40 a having one surface coated with thesilicone layer 40 b is prepared, then the separator 40 is extended, thenthe copper foil 16 is pasted onto the separator 40 via the firstadhesive layer 12 and the resin layer 14, and then the copper layerpattern 16 a is formed by patterning the copper foil 16 by theroll-to-roll method.

Then, the near-infrared absorbing layer 18 is formed on the copper layerpattern 16 a and the resin layer 14 via a second adhesive layer 12 a bythe roll-to-roll method. Then, the PET or TAC reflection preventinglayer 20 is formed on the near-infrared absorbing layer 18 via a thirdadhesive layer 12 b.

In this case, like the variations of the first and fourth embodiments,instead of the near-infrared absorbing layer 18, the third adhesivelayer 12 b, and the reflection preventing layer 20, the surface of thePET or TAC film, which has the reflection preventing layer on onesurface and the near-infrared absorbing layer on the other surface, maybe pasted, on its near-infrared absorbing layer side, onto the secondadhesive layer 12 a over the separator 40.

Seventh Embodiment

FIG. 9A to FIG. 9G are schematic sectional views showing a shieldingbase member manufacturing method according to a seventh embodiment ofthe present invention. The seventh embodiment is intended not to leavedent defects in the adhesive layer, which remains in the final shieldingbase member, by replacing the adhesive layer of the shielding basemember with a new adhesive layer in the course of the manufacturingsteps. In this description, a detailed explanation of the steps similarto the manufacturing method of the first embodiment are omitted.

In the shielding base member manufacturing method according to theseventh embodiment, as shown in FIG. 9A, first a first PET film 50 athat has a temporary adhesive layer 50 b with a thickness of about 25μm, for example, on one surface is prepared as a first protect film 50.

Then, a copper foil 16 (metal foil) whose thickness is about 10 μm, forexample, is prepared. At this point the bright surface of the copperfoil 16 has been blackened by electrolytic plating in the same way as inthe first embodiment.

Then, as shown in FIG. 9B, the resin layer 14 is formed on the temporaryadhesive layer 50 b of the first protect film 50. The copper foil 16 isthen arranged such that the blackened surface of the copper foil 16 isdirected to and then pasted onto the resin layer 14 by applying thepressure to the copper foil 16 in the same method as in the firstembodiment.

Accordingly, a structure in which the resin layer 14 and the copper foil16 are laminated sequentially from the bottom on the first protect film50 is formed. Since the copper foil 16 is pasted onto the first protectfilm 50, which is rigid and which has the temporary adhesive layer 50 b,via the resin layer 14, the handling of the copper foil 16 isfacilitated.

Then, as shown in FIG. 9C, the first protect film 50 is transported bythe roll-to-roll method and a resist pattern (not shown) is formed onthe copper foil 16. The copper foil 16 is then etched by spraying aniron (III) chloride aqueous solution, or the like onto the copper foil16 in a manner similar to the first embodiment using the resist patternas a mask to form the copper layer pattern 16 a (pattern of the metallayer), like a mesh, for example.

At this time, since the copper foil 16 is pasted onto the first protectfilm 50 having rigidity, copper foil 16 can withstand the pressure ofthe sprayed etchant and thus the copper foil 16 remains stablethroughout etching.

Then, the exposed surface of the copper layer pattern 16 a is blackenedby applying to the copper layer pattern 16 a a mixed solution consistingof chlorite soda aqueous solution and caustic soda aqueous solution.Since the surface of the copper foil 16 on the resin layer 14 side hasalready been blackened as described above, both surfaces and the sidesurfaces of the copper layer pattern 16 a are completely blackened, asshown in FIG. 9C, at a point of time when this step is ended.

In this manner, as shown in FIG. 9C, the first transfer sheet 32,consisting of the resin layer 14 and the copper layer pattern 16 a, isformed on the first protect film 50.

In the above-described formation of the copper layer pattern 16 a, etc.,the roll-to-roll method is employed. Therefore, if the temporaryadhesive layer 50 b is pressed by foreign matter when the first protectfilm 50, on which the etching of the copper foil 16 has been completed,is wound on the roll, or the like, dent defects readily form in thetemporary adhesive layer 50 b because the temporary adhesive layer 50 bitself is soft.

However, in the shielding base member manufacturing method of thepresent embodiment, as described later, the temporary adhesive layer 50b is replaced with a new and different first adhesive layer. Therefore,there is no problem even if dents form in the temporary adhesive layer50 b. In this case, the temporary adhesive layer is also called thefirst adhesive layer, and the first adhesive layer is also called thesecond adhesive layer.

Then, as shown in FIG. 9D, the first transfer sheet 32 consisting of theresin layer 14 and the copper layer pattern 16 a is obtained by cuttingthe first protect film 50 to a predetermined dimension and thenseparating the temporary adhesive layer 50 b from the resin layer 14. Atthis time, the first protect film 50 having the temporary adhesive layer50 b with the dent defects discarded.

Then, as shown in FIG. 9E, a second PET film 30 x, on one surface ofwhich a silicone layer 30 y (release layer) of about 1 μm thickness iscoated and which has a predetermined dimension, is prepared. Thesilicone layer 30 y is formed by the same method as used in the firstembodiment. This second PET film 30 x, on one surface of which thesilicone layer 30 y is formed, is called “separator 30” hereinafter.

Then, as shown in FIG. 9E, similarly, a second protect film 50 xconsisting of the separator 30 and the first adhesive layer 12 is formedby forming the first adhesive layer 12 of about 25 μm thickness on thesilicone layer 30 y of the separator 30. Then, the resin layer 14 andthe copper layer pattern 16 a are formed on the first adhesive layer 12of the second protect film 50 x by pasting the surface of the firstadhesive layer 12 of the second protect film 50 x onto the surface ofthe resin layer 14 of the above transfer sheet 32.

Accordingly, the first adhesive layer 12 is present under the resinlayer 14 instead of the above-mentioned temporary adhesive layer 50 b.In other words, even when dent defects are formed in the temporaryadhesive layer 50 b, such temporary adhesive layer 50 b may be replacedwith the new first adhesive layer 12 that has no such defects. Then,since there is no need to employ the roll-to-roll method after the stepof forming the first adhesive layer 12 on the second protect film 50 x,the first adhesive layer 12 is not wound onto the roll. Therefore, thereis no possibility that dent defects due to foreign matter, or the likewill newly form in the first adhesive layer 12. As a result, the firstadhesive layer 12 that is left in the final shielding base member willhave no dent defect.

Then, the separator 30 is removed from the structural unit shown in FIG.9F by separating the silicone layer 30 y (release layer) of theseparator 30 from the first adhesive layer 12 along the interfacetherebetween. Thus, the second transfer sheet 32 a that consists of thefirst adhesive layer 12, the resin layer 14, and the copper layerpattern 16 a in sequence from the bottom is obtained.

Then, as shown in FIG. 9G, the transparent glass substrate 10(transparent substrate), on a predetermined peripheral portion of onesurface of which the black frame layer 22 is formed and which has apredetermined dimension, is prepared. The surface of the first adhesivelayer 12 of the transfer body 32 a is pasted onto the surface of theglass substrate 10 opposite that on which the black frame layer 22 isformed. Accordingly, the first adhesive layer 12 which has no dentdefects, the resin layer 14, and the copper layer pattern 16 a areformed sequentially from the glass substrate 10.

Then, as shown in FIG. 3A (first embodiment), the second adhesive layer12 a having a color correcting function is formed on the copper layerpattern 16 a and the resin layer 14 by the same method as used in thefirst embodiment, leaving exposed the copper layer pattern 16 a on thepredetermined peripheral portion of the glass substrate 10. Then, thenear-infrared absorbing layer 18 is formed on this second adhesive layer12 a.

Then, the third adhesive layer 12 b having the ultraviolet (UV)absorbing function is formed on the near-infrared absorbing layer 18.And then a PET reflection preventing layer 20 having a reflectionpreventing function is formed on the third adhesive layer 12 b, using aPET film having a reflection preventing layer formed on one surfacethereof, or the like.

In this manner, a shielding base member the same as the shielding basemember 26 shown in FIG. 3A can be obtained by the method of the seventhembodiment.

As described above, the shielding base member manufacturing method ofthe seventh embodiment is provided to prevent the situations wherein thePET film (except the PET reflection preventing layer 20), whose opticaltransmittance is low and whose haze is high, would become incorporatedinto the shielding base member 26 and also to prevent the dent defectsin the adhesive that is left in the shielding base member product.

More particularly, first the resin layer 14 and the copper foil 16 areformed on the first protect film 50, and then the copper layer pattern16 a is formed by patterning the copper foil 16. At this time, since theroll-to-roll method is employed for the purpose of improving theproduction efficiency, dent defects easily form in the temporaryadhesive layer 50 b. In order to remove the temporary adhesive layer 50b with the dent defects, the temporary adhesive layer 50 b of the firstprotect film 50 is separated from the resin layer 14 along theinterface. Thus, the first transfer sheet 32, consisting of the resinlayer 14 and the copper layer pattern 16 a formed thereon, is obtained.

A second protect film 50 x is obtained by forming the first adhesivelayer 12 on the silicone layer 30 y (release layer) of the separator 30.Then, the surface of the resin layer 14, which docs not carry a copperlayer pattern, of the first transfer sheet 32 is adhered to the surfaceof the first adhesive layer 12 of the second protect film 50 x.Accordingly, the new first adhesive layer 12 without any dent defect isprovided under the resin layer 14.

Then, the second transfer sheet 32 a, consisting of the first adhesivelayer 12, the resin layer 14, and the copper layer pattern 16 a, isobtained by separating the first adhesive layer 12 from the siliconelayer 30 y (release layer) of the separator 30 along the interface.Then, the exposed surface of the first adhesive layer 12 of this secondtransfer sheet 32 a is pasted onto one surface of the glass substrate10. Thus, the first adhesive layer 12 that has no dent defect, the resinlayer 14, and the copper layer pattern 16 a are formed on the glasssubstrate 10 sequentially from the bottom.

As described above, according to the method of the seventh presentembodiment, since the PET films 50 a, 30 x do not remain in theshielding base member, the shielding base member has high opticaltransmittance and low haze. Also, since the copper foil 16 is formed onthe first protect film 50 which is rigid, such copper foil 16 can bepatterned by the roll-to-roil method while unrolling first protect film50, and thus production efficiency can be improved.

In addition, even if the dent defects occur in the temporary adhesivelayer 50 b at this time, no dent defects will be present in the firstadhesive layer 12 of the shielding base member because the temporaryadhesive layer 50 b can be replaced with a new first adhesive layer 12.Therefore, a shielding base member of high quality can be manufactured.

Eighth Embodiment

FIG. 10A to FIG. 10C are schematic sectional views showing a shieldingbase member manufacturing method according to an eighth embodiment ofthe present invention, and FIG. 11 is a schematic sectional view showinga shielding base member according to the eighth embodiment of thepresent invention. The difference between the manufacturing method ofthe eighth embodiment and that of the sixth embodiment is that thesecond transfer sheet, consisting of the first adhesive layer, the resinlayer, and the copper layer pattern, manufactured according to themethod of the seventh embodiment, is pasted directly onto the displayscreen of the PDP to serve as the shielding base member.

In the manufacturing method of the eighth embodiment, as shown in FIG.10A, first a structure the same as that shown in FIG. 9E in the seventhembodiment is formed. That is, a structure in which the first adhesivelayer 12 has no dent defects, the resin layer 14, and the copper layerpattern 16 a are formed on the second protect film 50 x.

The second protect film 50 x is cut to a predetermined size. Then, asshown in FIG. 10B, the second adhesive layer 12 a is formed on thecopper layer pattern 16 a and the resin layer 14 leaving the copperlayer pattern 16 a exposed at the predetermined peripheral portion.Then, the near-infrared absorbing layer 18 is formed on the secondadhesive layer 12 a.

The third adhesive layer 12 b is formed on the near-infrared radiationabsorbing layer 18, and then the PET reflection preventing layer 20 isformed on the third adhesive layer 12 b.

Then, as shown in FIG. 10C, the separator 30 is removed from thestructural unit shown in FIG. 10B by separating the silicone layer 30 y(release layer) of the separator 30 from the first adhesive layer 12along their interface.

Accordingly, as shown in FIG. 11, a shielding base member 26 hconsisting of the first adhesive layer 12 that is free of dent defects,the resin layer 14, the copper layer pattern 16 a, the second adhesivelayer 12 a, the near-infrared absorbing layer 18, the third adhesivelayer 12 b, and the PET reflection preventing layer 20, sequentiallyfrom the bottom, is obtained. Of course, the shielding base member maybe constructed by omitting the near-infrared absorbing layer 18, the PETreflection preventing layer 20, etc.

Then, as shown in FIG. 11, the PDP shielding base member is obtained bypasting the exposed surface of the first adhesive layer 12 of theshielding base member 26 h directly onto the display screen of the PDP.

According to the method of the eighth embodiment, since the PET filmdoes not remain in the shielding base member 26 h like the firstembodiment, a shielding base member having high optical transmittanceand low haze is easily manufactured. Also, since the first adhesivelayer 12 having no dent defects remains in the shielding base member 26h, a shielding base member of the high quality can be manufactured.

In this case, as in the variation (the structure in FIG. 3B) of thefirst embodiment, the PET film 21, having the near-infrared absorbinglayer 23 and the reflection preventing layer 25 respectively formed onits opposing surfaces, may be adhered to the second adhesive layer 12 a.Also, like the second embodiment, the near-infrared absorbing layer maybe omitted and the near-infrared absorbing function may be provided bythe adhesive layer.

In addition, the TAC reflection preventing layer may be employed inplace of the PET reflection preventing layer 20. The third adhesivelayer 12 b, for example, may have the ultraviolet (UV) absorbingfunction, as in the first embodiment, if the PET reflection preventinglayer is employed, whereas the TAC reflection preventing layer itselfmay have an ultraviolet (UV) absorbing function, as in the fourthembodiment, if the TAC reflection preventing layer is employed. Also,like the first embodiment, at least one of the first, second, and thirdadhesive layers 12, 12 a, 12 b may have a color correcting function.

In the above manner, the shielding base member 26 h of the eighthembodiment is manufactured.

Ninth Embodiment

FIG. 12 is a schematic sectional view showing a shielding base memberaccording to a ninth embodiment of the present invention, and FIG. 13 isa schematic sectional view showing a variation of the shielding basemember according to the ninth embodiment of the present invention. InFIG. 12 and FIG. 13, the same symbols are affixed to the same elementsas those in FIG. 3A and others, and their detailed explanation isomitted.

The difference between the shielding base member of the ninth embodimentand that of the other embodiments is that, as shown in FIG. 12, theplastic film having the near-infrared absorbing function is not utilizedas the near-infrared absorbing layer and, instead, the near-infraredabsorbing function is provided by a resin layer 14 x.

The method of the ninth embodiment is the same as the manufacturingmethods of the first and seventh embodiments except for the resin layerforming step. Therefore, the step of forming the resin layer 14 x havingthe near-infrared absorbing function on the first adhesive layer 12 willbe explained here.

First, coating liquids for forming the near-infrared absorbing layer areprepared by stirring a mixture of pigment material (Tx-EX811Kmanufactured by Nippon Shokubai Co., Ltd.), acrylic resin (Dianal BR-80manufactured by Mitsubishi Rayon Co., Ltd.), toluene, and methyl ethylketone, with the pigment content of the different coating liquids at 1wt %, 2 wt %, 3 wt %, and 3 wt %, respectively.

Then, this coating liquid is coated on the first adhesive layer 12 bythe roll coating method, or the like, and then this first adhesive layer12 is left as is at about 50° C. for 48 hours, for example. Accordingly,the resin layer 14 x having the near-infrared absorbing function isformed on the first adhesive layer 12. The resin layer 14 x obtained inthis manner can absorb the spectrum near 820 nm that is emitted from thePDP.

Alternatively, coating liquids for forming the near-infrared absorberare prepared by stirring mixtures of copolymer polyester resin, methylethyl ketone, and toluene with 1 wt %, 2 wt %, 3 wt %, and 3 wt %,respectively, of pigment material (Kayasorb IRG-022 manufactured byNippon Kayaku Co., Ltd.). Then, this coating liquid is coated on thefirst adhesive layer 12 by the roll coating method, or the like, andthen the resin layer 14 x having the near-infrared absorbing function isformed by leaving this first adhesive layer 12 as is at about 50° C. for48 hours, for example. The resin layer 14 x obtained in this manner canabsorb the spectrum of 850 to 1200 nm that is emitted from the PDP.

In this case, since the maximum absorption wavelength differs accordingto the color tone of the pigment material, the type of the pigmentmaterial can be adjusted appropriately to meet the requirement of theshielding base member. For example, one type of pigment material may beemployed, or plural different pigment materials may be employed toabsorb the light in the wide area of the near-infrared range. It ispreferable that at least the pigment material having the maximumabsorption wavelengths such as 820 nm, 880 nm, 980 nm, etc., which areused particularly in remote control units and in optical communication,in the near-infrared range should be blocked.

It is preferable that plural pigment materials should be contained inthe resin layer 14 x so as to absorb the near-infrared radiation in thepredetermined wavelength range. In this case, if the resin layer 14 xcontains a plurality of pigment materials, the possibility thatdurability may be reduced by the catalytic effect, etc., must beconsidered. That is, in some cases optical characteristics such as thenear-infrared shielding characteristic, the color, etc. of the resinlayer 14 x change with the lapse of time.

Therefore, if one type or several types of pigment materials areincluded in the resin layer 14 x and if pigment materials which canabsorb the near-infrared radiation of the wavelength that cannot beabsorbed by the resin layer 14 x, are included in the second adhesivelayer 12 a or in the PET reflection preventing layer 20, near-infraredradiation over a wide wavelength range may be absorbed.

For example, if the above resin layer 14 x that can absorb the spectrumnear 820 nm is employed, the pigment material that can absorb thespectrum of 850 to 1200 nm may be included in the second adhesive layer12 a or in the PET reflection preventing layer 20. Also, if the aboveresin layer 14 x that can absorb the spectrum of 850 to 1200 nm isemployed, the pigment material that can absorb the spectrum near 820 nmmaybe included in the second adhesive layer 12 a or in the PETreflection preventing layer 20.

In addition, the color correcting function for correcting thetransmission color, the object color, etc. may be provided by includingthe pigment, which can absorb wavelengths in the visible range, in theresin layer 14 x. For instance, a mixed gas consisting of xenon and neonis employed as a discharge medium in the color PDP, and the orange lightemission of the neon acts as one factor to lower the color displayperformance of the PDP. For this reason, the color correction in thecolor display of the PDP can be provided by including a pigment materialwhich can suppress the light emission of the neon, for example in theresin layer 14 x.

In this manner, in the shielding base member 26 i of the presentembodiment, a plastic film having the near-infrared absorbing functionis not particularly needed and the near-infrared absorbing function isprovided by the resin layer 14 x itself. Therefore, the structure of theshielding base member 26 i can be made simple. Also, since the plasticfilm serving as the near-infrared absorbing layer is omitted, theoptical transmittance becomes higher and the haze becomes lower, andthus the display of the PDP is further improved.

Next, a variation of the shielding base member of the ninth embodimentwill be explained. According to this variation, if only one type orseveral types of pigment materials are added to improve the durabilityof the resin layer 14 x, the near-infrared radiation wavelengths thatcannot be absorbed by the resin layer 14 x are shielded by themulti-layered film that cuts off the near-infrared radiation byutilizing the reflection characteristic (optical interference) of thelight.

First, as shown in FIG. 13, a structural body in which the firstadhesive layer 12, the resin layer 14 x for absorbing light of aparticular wavelength, and the copper layer pattern 16 a are formed onthe glass substrate 10 by the manufacturing method of the first orseventh embodiment. As also shown in FIG. 13, a highly transparentpolyester film 21 a is then prepared and a multi-layered film 21 y isformed by laminating a metal oxide thin film such as zinc oxide, indiumoxide, or the like and a metal thin film such as silver, silver alloy,or the like on one surface of the film 21 a by the sputtering method orthe like. For example, a multi-layered film 21 may be formed byrepeating three to six times the formation of a film consisting of ametal oxide thin film/a metal thin film. Then, a multi-layered film 21is obtained by forming a reflection preventing layer 21 x on the othersurface of the highly transparent polyester film 21 a.

Instead of formation of the multi-layered film 21 y on the highlytransparent polyester film 21 a, a film having the near-infraredshielding function is provided by laminating the highly transparentresin films, each having a different refractive index, and then themulti-layered film 21 may be produced by forming the reflectionpreventing layer 21 x on this film.

The multi-layered film 21 formed in this manner can reflect light in apredetermined near-infrared range by utilizing the light reflectioncharacteristic (optical interference) of the multi-layered film 21 y toshield the light and also to have the light reflection preventingfunction.

Then, as also shown in FIG. 13, the second adhesive layer 12 a is formedon the copper layer pattern 16 a and the resin layer 14 x, and then thesurface of the multi-layered film 21 on the multi-layered film 21 y sideis adhered to the glass substrate 10 via the second adhesive layer 12 a.Accordingly, the multi-layered film 21 having the multi-layered film 21y and the reflection preventing layer 21 x is formed on the secondadhesive layer 12 a. In the above manner, the shielding base member 26 jof the variation of the ninth embodiment is completed.

The shielding shielding base member 26 j of this variation of the ninthembodiment provides substantially the same functions and effects as thepreviously described shielding base member 26 i. Also, since a highlytransparent polyester film is used as the plastic film, the opticaltransmittance of the shielding base member can be increased and the hazecan be reduced.

The details of the present invention are explained as above withreference to the first to ninth embodiments. However, the scope of thepresent invention is not limited to the above embodiments and variationsof the above embodiments which do not depart from the gist of thepresent invention are contained in the scope of the present invention.

What is claimed is:
 1. A shielding base member comprising, in sequence:a transparent substrate; a first adhesive layer formed on thetransparent substrate; a resin layer formed on the first adhesive layer;a metal layer pattern formed on the resin layer; and a reflectionpreventing layer formed on the metal layer pattern via a third adhesivelayer, said shielding base member being produced by the processcomprising: forming on a release surface of a plastic support film, insequence, a first adhesive layer, a resin layer, and a metal foil;forming a pattern in the metal foil; removing the plastic support filmby separating the plastic support film at the interface between therelease surface and the first adhesive layer; and then adhering thefirst adhesive layer, without the plastic support film, onto atransparent substrate to form the shielding base member, wherein thefirst adhesive layer is in direct contact with the transparentsubstrate, the resin layer is in direct contact with the first adhesivelayer, and the metal layer pattern is in direct contact with the resinlayer.
 2. The shielding base member according to claim 1, furthercomprising: a plastic film on one surface of which a reflectionpreventing layer is formed; a near-infrared absorbing layer formed onanother surface of the plastic film for absorbing near-infraredradiation in the range of 820 to 1200 nm; and wherein the third adhesivelayer formed over near-infrared absorbing layer is adhered to thetransparent substrate.
 3. The shielding base member according to claim1, wherein surfaces of the metal layer pattern on a resin layer side anda surface and side surfaces of the reflection preventing layer areblack.
 4. The shielding base member according to claim 1, wherein atleast one of the first adhesive layer and the third adhesive layerabsorbs near-infrared radiation in the range of 820 to 1200 nm.
 5. Theshielding base member according to claim 1, further comprising: anear-infrared absorbing layer formed on the metal layer pattern and theresin layer via a second adhesive layer and between the metal layerpattern and the third adhesive layer.
 6. The shielding base memberaccording to claim 1, wherein the reflection preventing layer is formedon a PET (polyethylene terephthalate) film, and at least one of theadhesive layers has an ultraviolet absorbing function.
 7. The shieldingbase member according to claim 1, wherein the reflection preventinglayer is formed on a triacetylcellulose film and has an ultravioletabsorbing function.
 8. The shielding base member according to claim 1,wherein at least one of the adhesive layers has a color correctingfunction.
 9. The shielding base member according to claim 1, wherein thetransparent substrate is formed of glass.
 10. A shielding base membercomprising, in sequence: a transparent substrate; a first adhesive layerformed on the transparent substrate; a resin layer formed on the firstadhesive layer and having at least a function of absorbing near-infraredradiation in a range of 820 to 1200 nm; a metal layer pattern formed onthe resin layer; and a filter layer formed on the metal layer via asecond adhesive layer and having at least a reflection preventingfunction; and wherein the shielding base member is produced by theprocess comprising; forming on a release surface of a plastic supportfilm, in sequence a first adhesive layer, a resin layer, and a metalfoil; forming a pattern in the metal foil; removing the plastic supportfilm by separating the plastic support film at the interface between therelease surface and the first adhesive layer; and then adhering thefirst adhesive layer, without the plastic support film, onto atransparent substrate to form the shielding base member, wherein thefirst adhesive layer is in direct contact with the transparentsubstrate, the resin layer is in direct contact with the first adhesivelayer, and the metal layer pattern is in direct contact with the resinlayer.
 11. The shielding base member according to claim 10, wherein theresin layer includes a pigment material that absorbs the near-infraredradiation.
 12. The shielding base member according to claim 10, whereinthe resin layer further has a color correcting function.
 13. Theshielding base member according to claim 11, wherein the filter layerfurther has a function of absorbing the near-infrared radiation having adifferent wavelength than the wavelength of the near-infrared radiationwhich is absorbed by the resin layer.
 14. The shielding base memberaccording to claim 11, wherein the filter layer includes a plastic film,a reflection preventing layer formed on one surface of the plastic film,and a layer for absorbing the near-infrared radiation formed on anothersurface of the plastic film.
 15. The shielding base member according toclaim 11, wherein the filter layer includes a plastic film, a reflectionpreventing layer formed on one surface of the plastic film, and a layerfor shielding the near-infrared radiation formed on another surface ofthe plastic film, the filter layer having a multi-layered structurefurther including a metal oxide layer and a metal film.
 16. Theshielding base member according to claim 2 wherein the near-infraredabsorbing layer is adhered to an exposed surface of the glass substrate.